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| 1. general description the tea1501 is the low power member of the greenchip family and is especially designed for standby switched mode power supply (smps) applications. the tea1501 incorporates all the necessary functions for an ef?cient and low cost power supply for 90 v to 276 v ac universal input. the tea1501 is a monolithic integrated circuit and is available in a so8 package. the design is made in the bcd_powerlogic750 process and includes the high voltage switching device. using only seven functional pins, the tea1501 contains extensive control functions to form a ?exible and a reliable power supply with a minimum of external components. the tea1501 operates in a ?yback topology (see figure 3 ) with a ?xed switching frequency, constant primary peak current control and regulates the output voltage in burst mode. applications include low power and standby power supplies as used in television, monitor, lighting electronics and domestic appliances with an output power from 0.1 w to 3 w. 2. features 2.1 distinctive features n direct off-line operation (90 v to 276 v ac) n low external component count n integrated high voltage start-up current source for a fast start-up within 0.25 s n integrated power switch: 650 v, 40 w , 0.25 a n programmable primary peak current n data transfer from isolated secondary side to non-isolated primary side via the transformer n on/off function replaces expensive mains switch by a functional switch 2.2 green features n low current consumption in off mode, typical 40 m a n ef?cient burst mode operation, for 0.1 w to 3 w output power 2.3 protection features n cycle-by-cycle current control with programmable primary peak current n overvoltage protection n undervoltage lockout n overtemperature protection tea1501 greenchip smps controller ic rev. 02 31 march 2006 product data sheet
tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 2 of 21 philips semiconductors tea1501 greenchip smps controller ic 3. quick reference data 4. ordering information 5. block diagram table 1. quick reference data symbol parameter conditions min typ max unit v on/off on/off level 0.4 0.7 0.9 v v data(off) data off level 20 m a 0.9 v - 2.4 - 1.8 - 1.2 ma i drain(off) pin drain current in off mode v ood < 0.4 v; v drain = 300 v - 40 100 m a v bd breakdown voltage i drain(off) + 100 m a 650 - - v r dson on resistance t j =25 c; i drain =80ma 25 40 55 w v detect detection level 0.47 0.50 0.53 v table 2. ordering information type number package name description version TEA1501T so8 plastic small outline package; 8 leads; body width 7.5 mm sot176-1 fig 1. block diagram mgm820 v aux management reference block temperature protection switch oscillator startup current source supply current tracking modulator on/off level data off data on burst oscillator logic tea1501 counter power switch gate driver leading edge blanking 5 6 3 2 48 1 v detect drain ood gnd aux ref burst source tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 3 of 21 philips semiconductors tea1501 greenchip smps controller ic 6. pinning information 6.1 pinning 6.2 pin description 7. functional description the tea1501 contains a high voltage power switch, a high voltage start-up circuit and low voltage control circuitry on the same ic. together with a transformer and a few external components a low power, isolated, ?yback converter can be built, see figure 3 . the system of the tea1501 operates in a burst mode. during each burst period the output voltage is regulated to a desired voltage level. fig 2. pin con?guration: TEA1501T (sot176-1) tea1501 source drain ood n.c. burst gnd ref aux 001aae123 1 2 3 4 6 5 8 7 table 3. pin description symbol pin description source 1 source of the power switch and input for primary current sensing ood 2 on/off input and data transfer output burst 3 input for burst capacitor ref 4 input for reference resistor aux 5 supply input of the ic and input for voltage regulation gnd 6 ground n.c. 7 not connected to comply with safety requirements drain 8 drain of the power switch and input for start-up current tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 4 of 21 philips semiconductors tea1501 greenchip smps controller ic 7.1 system operation 7.1.1 on/off the system of the tea1501 can be switched on and off by means of a low cost, low voltage switch. in the off mode the start-up current source and power switch are disabled. in the on mode, the tea1501 delivers the start-up current for the supply capacitor and after the supply voltage reaches the start-up level, the tea1501 activates the power switch. 7.1.2 start-up the start-up is realized with a high voltage start-up current source instead of a dissipative bleeder resistor which is commonly used by low voltage control ics. when the tea1501 is switched on, the start-up current source is enabled and starts charging the aux capacitor. the start-up current level is high and accurate (typical 1.8 ma) which results in a well-de?ned and short start-up time, within 0.25 s. after the supply voltage reaches the start-up level the current source is switched off and the aux capacitor supplies the chip. reducing the power dissipation in the current source to zero after start-up is one of the green features of the tea1501. 7.1.3 operation after start-up the ?yback converter starts delivering energy to the secondary and auxiliary winding. the system of the tea1501 works with ?xed switching frequency and ?xed peak current. as all the windings of the ?yback transformer have the same ?ux variation, the secondary voltage and the auxiliary voltage are related via the turns-ratio (n s : n a ). therefore, the isolated secondary voltage is controlled by the non-isolated auxiliary voltage. (1) the secondary earthing point is isolated from the primary earthing points. fig 3. basic ?yback con?guration mgm823 tea1501 on/off n p n a n s (1) v out v in v zener load source ood burst ref r source c burst r ref drain n.c. gnd aux tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 5 of 21 philips semiconductors tea1501 greenchip smps controller ic the burst mode operates by switching at high frequency until v aux reaches its regulation level of 20 v. the tea1501 stops switching until the time period set by the burst oscillator has expired. at the start of the next burst period the tea1501 starts switching at high frequency and repeats the cycle again. to guarantee a stable operation in a burst mode controlled system a v aux slope compensation circuit is integrated in the tea1501. the tea1501 delivers a constant voltage to the secondary load until a burst duty cycle of 40 % is reached. 7.1.4 data transfer the tea1501 has a data transfer function which makes communication from the isolated secondary side to the non-isolated primary side of the transformer possible, without using an opto-coupler. this communication function is activated by increasing the secondary load. with this data transfer function a main power supply can be switched on and off by the system of the tea1501. the power delivered to the secondary and auxiliary winding is proportional to the number of primary current pulses per burst period, provided that the converter operates in discontinuous conduction mode. during each burst period the number of primary current pulses is counted. a threshold (n data ) of 56 pulses is integrated. the clamp level on the ood pin is set to data-on level from data-off level in case the n data threshold is passed. this data-on clamp level can be sensed by the on/off input of a main supply control ic of the greenchip family. the data-on clamp level is maintained until a burst appears with a number of pulses below the n data threshold. tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 6 of 21 philips semiconductors tea1501 greenchip smps controller ic 7.2 waveforms in the off mode, start-up mode and operation mode 7.3 circuit block description 7.3.1 on/off/data section the on/off/data block contains a comparator for the on/off level and is active if the drain voltage is above 50 v (dc). the typical current consumption in off mode is 40 m a. the data signal changes the clamp level on the ood pin to indicate data transfer: low clamp level for data-off and high clamp level for data-on. 7.3.2 v aux management the v aux management block is active when the tea1501 is in the on mode. this v aux management block senses the aux voltage and determines the state of the tea1501: start-up or normal operation. during start-up the following circuits are active: on/off/data section, reference block (partial), v aux management, temperature protection and the start-up current source. fig 4. waveforms of the tea1501 in the off mode, start-up mode and operation mode mgm828 switch period burst period operation startup off v ood on/off level v burst v out v aux regulation level v source detection level v drain switch on time burst on time tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 7 of 21 philips semiconductors tea1501 greenchip smps controller ic 7.3.3 start-up current source the start-up sequence is carried out using an accurate start-up current source. the start-up current ?ows from the drain pin to the aux pin via the start-up current source and charges the aux capacitor. when aux reaches the start-up threshold the start-up current is switched off and the ?yback converter starts operating and the output voltage rises. the aux capacitor must be capable of supplying the entire supply current (i aux(low) ) until the output voltage is in regulation. from that moment the aux capacitor is charged by the ?yback converter via the auxiliary winding. 7.3.4 reference block the reference block contains a band gap circuit which determines all the accurate and temperature independent reference voltages and currents. it de?nes the voltage detection level for the primary current comparator and it de?nes the voltage at the ref pin. the value of the reference resistor determines the burst frequency, the switching frequency and the leading edge blanking time. 7.3.5 temperature protection the temperature protection circuit senses the chip temperature using a proportional to absolute temperature voltage (v ptat ) generated in the reference block. if the chip temperature exceeds 140 c the power switch and the start-up current source are disabled. when the chip cools down below 100 c, the start-up circuit is enabled again. 7.3.6 switch oscillator the switch oscillator determines the switching frequency and the maximum on-time of the power switch. the maximum on-time is set at 66 % of the switching period. the switching frequency is determined by the reference resistor at the ref pin and an internal capacitor. the switching frequency can be adjusted in a range from 20 khz to 50 khz, thus above the audible spectrum. 7.3.7 burst oscillator the burst oscillator generates a triangular wave signal for determination of the burst frequency. the burst frequency is determined accurately and temperature independent by the externally connected reference resistor r ref and burst capacitor c burst . fig 5. i aux as a function of v aux mgm824 20 v 16 v 12 v uvlo v start v aux(max) v aux start-up operation i aux i start tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 8 of 21 philips semiconductors tea1501 greenchip smps controller ic 7.3.8 gate driver the gate driver switches the power switch. the power switch is turned on at the beginning of every oscillator cycle and is turned off by the primary current comparator or by the maximum on-time. the power switch is also prevented from turning on if v aux has reached its regulation level or in the case of active overtemperature protection or active undervoltage lockout protection. 7.3.9 power switch the power switch is an integrated high voltage lateral diffused metal oxide semiconductor transistor (ldmost) with a r dson of 40 w , a maximum peak drain voltage of 650 v, a maximum continuous drain voltage of 500 v and a maximum drain current of 0.25 a. 7.3.10 primary current comparator the primary current comparator senses the voltage across the external sense resistor r source which re?ects the primary current. the detection level of the comparator is 0.5 v. the power switch is switched off quickly when the source voltage exceeds this detection level. the comparator has a typical propagation delay of 80 ns. if the dv/dt of the drain voltage has to be limited for electromagnetic interference (emi) reasons, a capacitor can be connected between the drain and source pins of the tea1501. the discharge current of this emi capacitor does not ?ow through the sense resistor r source and does not activate the comparator. 7.3.11 leading edge blanking to prevent the power switch from switching off due to the discharge current of the capacitance on the drain pin a leading edge blanking (leb) circuit has been implemented. the leading edge blanking time is de?ned as the maximum duration time needed to discharge the capacitance at the drain of the power switch. the leading edge blanking time is determined by the reference resistor to obtain an accurate and temperature independent time. the leb time tracks with the period time of the switch oscillator. 7.3.12 modulator the modulator determines the regulation level of v aux . for a burst duty cycle from 0 % to 40 % the aux voltage is regulated to 20 v. for stable operation in burst mode a decrease in regulation voltage is integrated for a burst duty cycle above 40 %. at 100 % burst duty cycle the regulation voltage is 17.5 v. tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 9 of 21 philips semiconductors tea1501 greenchip smps controller ic 7.3.13 counter the power delivered to the load (auxiliary and secondary) is a function of the number of energy pulses per burst, according to the following formula where h is the ef?ciency, l p is the primary inductance, i prim is the primary peak current, f burst is the burst frequency and n is the number of pulses in one burst period. the counter counts the number of pulses in each burst period and detects if the n data threshold is passed. the counter state is used for the data transfer function and for the supply current tracking. 7.3.14 supply current tracking for obtaining good load regulation, especially with low cost transformers, a tracking circuit is included. the tracking circuit makes the supply current of the tea1501 a function of the secondary load. this makes the voltage drop across the series resistance of the auxiliary winding proportional to the voltage drop across the series resistance of the secondary winding. therefore, the secondary output voltage tracks with the aux regulation voltage. the tracking starts at a counter state of 28. for a counter state from 28 up to 112 (typical values) the supply current of the tea1501 rises linearly with the counter state according to the following formula, see figure 7 . for counter states of 112 and higher the supply current remains on its maximum value. fig 6. regulation level aux as a function of burst duty cycle regulation level aux (v) s aux 17.5 20 0 0 40 cp aux burst duty cycle (%) 100 mgm826 p load h 1 2 -- - l p i prim 2 f burst n = i aux k tracking n = tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 10 of 21 philips semiconductors tea1501 greenchip smps controller ic 7.4 design equations 7.4.1 primary peak current the primary peak current is determined by the sense resistor r source and may be calculated as shown below: 7.4.1.1 minimum value of r source the maximum drain current is 0.25 a, this results in a minimum value for resistor r source of 2.0 w . 7.4.2 switch oscillator the maximum output power of the converter is a function of the switching frequency, provided that the converter operates in discontinuous conduction mode. where h is the ef?ciency, lp is the primary inductance, i prim is the primary peak current and f switch is the switching frequency. the switching frequency can be adjusted between 20 khz and 50 khz by the reference resistor r ref : 7.4.2.1 range of r ref values the minimum value for resistor r ref is 24 k w , the maximum value is 62 k w . fig 7. aux current as a function of counter state mgm825 i aux (ma) i aux(high) i aux(low) 6.7 1.7 28 56 n data counter state 112 r source v detect i prim ----------------- = p out max () h 1 2 -- - l p i prim 2 f switch = f switch 1 k switch r ref ------------------------------------ - = tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 11 of 21 philips semiconductors tea1501 greenchip smps controller ic 7.4.3 leading edge blanking the leading edge blanking time is determined by the reference resistor r ref as shown below: the leading edge blanking time consists of a constant time and a time which tracks with the period time of the switch oscillator. 7.4.4 burst oscillator the power threshold for data transfer is determined by the burst frequency, according to the following formula: the power ratio p data : p out(max) is therefore: the desired p data : p out(max) ratio determines the burst frequency. for example, when the desired p data : p out(max) ratio is 0.5 then the burst frequency has to be 450 hz at 50 khz switching frequency. the burst frequency can be adjusted by the reference resistor r ref and the burst capacitor c burst as shown below: 7.4.4.1 minimum value of c burst the minimum value for capacitor c burst is 3.3 nf. t leb t cons t tan k leb r ref () + = p data h 1 2 -- - l p i prim 2 f burst n data = p data p out max () ----------------------- f burst n data f switch ----------------------------------- = f burst 1 k burst r ref c burst ------------------------------------------------------------ - = fig 8. burst frequency as a function of power ratio mgm827 f burst (hz) f switch = 20 khz f switch = 50 khz 450 180 900 0 0 0.5 1 p data /p out(max) tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 12 of 21 philips semiconductors tea1501 greenchip smps controller ic 8. limiting values [1] the electrostatic discharge (esd) voltage according to the human body model is limited to 1200 v for pin 8 (drain). 9. thermal characteristics 10. characteristics table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). all voltages are referred to ground. positive currents ?ow into the ic. all pins not mentioned in the voltage list are not allowed to be voltage driven. symbol parameter conditions min max unit voltages v drain pin drain voltage commutation voltage peak: v in +v zener [1] - 0.4 +650 v v source pin source voltage - 0.4 +12 v v aux pin aux voltage - 0.4 +24 v v burst pin burst voltage - 0.4 +5 v currents i drain pin drain current 0 0.25 a i source pin source current 0 0.25 a i ood pin ood current - 1+5ma i ref pin ref current - 1+0ma i burst pin burst current - 1 +0.05 ma power and temperature p tot total power dissipation t amb <70 c - 0.7 w t j junction temperature - 10 +140 c t stg storage temperature - 40 +150 c t amb ambient temperature - 10 +70 c table 5. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air 96 k/w table 6. characteristics conditions unless otherwise speci?ed: - 10 c tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 16 of 21 philips semiconductors tea1501 greenchip smps controller ic 13. soldering 13.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for ?ne pitch smds. in these situations re?ow soldering is recommended. 13.2 re?ow soldering re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. several methods exist for re?owing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. typical re?ow peak temperatures range from 215 cto260 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: ? below 225 c (snpb process) or below 245 c (pb-free process) C for all bga, htsson..t and ssop..t packages C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. ? below 240 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. 13.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was speci?cally developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. ? for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 17 of 21 philips semiconductors tea1501 greenchip smps controller ic C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be ?xed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated ?ux will eliminate the need for removal of corrosive residues in most applications. 13.4 manual soldering fix the component by ?rst soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the ?at part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 c and 320 c. 13.5 package related soldering information [1] for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales of?ce. [2] all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . [3] these transparent plastic packages are extremely sensitive to re?ow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared re?ow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the re?ow oven. the package body peak temperature must be kept as low as possible. table 7. suitability of surface mount ic packages for wave and re?ow soldering methods package [1] soldering method wave re?ow [2] bga, htsson..t [3] , lbga, lfbga, sqfp, ssop..t [3] , tfbga, vfbga, xson not suitable suitable dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable [4] suitable plcc [5] , so, soj suitable suitable lqfp, qfp, tqfp not recommended [5] [6] suitable ssop, tssop, vso, vssop not recommended [7] suitable cwqccn..l [8] , pmfp [9] , wqccn..l [8] not suitable not suitable tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 18 of 21 philips semiconductors tea1501 greenchip smps controller ic [4] these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. [6] wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] wave soldering is suitable for ssop, tssop, vso and vssop packages with a pitch (e) equal to or larger than 0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on ?ex foil. however, the image sensor package can be mounted by the client on a ?ex foil by using a hot bar soldering process. the appropriate soldering pro?le can be provided on request. [9] hot bar soldering or manual soldering is suitable for pmfp packages. tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 19 of 21 philips semiconductors tea1501 greenchip smps controller ic 14. revision history table 8. revision history document id release date data sheet status change notice supersedes tea1501_2 20060331 product data sheet - tea1501_n_1 (9397 750 03371) modi?cations: ? the format of this data sheet has been redesigned to comply with the new presentation and information standard of philips semiconductors. ? added package so8, removed package dip8. see t ab le 2 order ing inf or mation , section 6.1 pinning and section 12 p ac kage outline ? removed tea1504 application (section low power standby application). tea1501_n_1 (9397 750 03371) 19980819 preliminary data sheet - - tea1501_2 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 02 31 march 2006 20 of 21 philips semiconductors tea1501 greenchip smps controller ic 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .semiconductors .philips .com. 15.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. philips semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local philips semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 15.3 disclaimers general information in this document is believed to be accurate and reliable. however, philips semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes philips semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use philips semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a philips semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. philips semiconductors accepts no liability for inclusion and/or use of philips semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale philips semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .semiconductors .philips .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by philips semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. greenchip is a trademark of koninklijke philips electronics n.v. 16. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation. philips semiconductors tea1501 greenchip smps controller ic ? koninklijke philips electronics n.v. 2006. all rights reserved. for more information, please visit: http://www.semiconductors.philips.com. for sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. date of release: 31 march 2006 document identifier: tea1501_2 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 distinctive features . . . . . . . . . . . . . . . . . . . . . . 1 2.2 green features . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.3 protection features . . . . . . . . . . . . . . . . . . . . . . 1 3 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 3 7.1 system operation . . . . . . . . . . . . . . . . . . . . . . . 4 7.1.1 on/off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.1.2 start-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.1.3 operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.1.4 data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 waveforms in the off mode, start-up mode and operation mode . . . . . . . . . . . . . . . . . . . . . . . . 6 7.3 circuit block description . . . . . . . . . . . . . . . . . . 6 7.3.1 on/off/data section . . . . . . . . . . . . . . . . . . . . . . 6 7.3.2 v aux management . . . . . . . . . . . . . . . . . . . . . . 6 7.3.3 start-up current source. . . . . . . . . . . . . . . . . . . 7 7.3.4 reference block . . . . . . . . . . . . . . . . . . . . . . . . 7 7.3.5 temperature protection. . . . . . . . . . . . . . . . . . . 7 7.3.6 switch oscillator . . . . . . . . . . . . . . . . . . . . . . . . 7 7.3.7 burst oscillator . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.3.8 gate driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.3.9 power switch . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.3.10 primary current comparator . . . . . . . . . . . . . . . 8 7.3.11 leading edge blanking . . . . . . . . . . . . . . . . . . . 8 7.3.12 modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.3.13 counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.3.14 supply current tracking . . . . . . . . . . . . . . . . . . . 9 7.4 design equations . . . . . . . . . . . . . . . . . . . . . . 10 7.4.1 primary peak current . . . . . . . . . . . . . . . . . . . 10 7.4.1.1 minimum value of r source . . . . . . . . . . . . . . . 10 7.4.2 switch oscillator . . . . . . . . . . . . . . . . . . . . . . . 10 7.4.2.1 range of r ref values. . . . . . . . . . . . . . . . . . . 10 7.4.3 leading edge blanking . . . . . . . . . . . . . . . . . . 11 7.4.4 burst oscillator . . . . . . . . . . . . . . . . . . . . . . . . 11 7.4.4.1 minimum value of c burst . . . . . . . . . . . . . . . . 11 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12 9 thermal characteristics. . . . . . . . . . . . . . . . . . 12 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12 11 test information . . . . . . . . . . . . . . . . . . . . . . . . 14 11.1 quality information . . . . . . . . . . . . . . . . . . . . . 14 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 13 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 13.1 introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 13.2 re?ow soldering. . . . . . . . . . . . . . . . . . . . . . . 16 13.3 wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 16 13.4 manual soldering . . . . . . . . . . . . . . . . . . . . . . 17 13.5 package related soldering information . . . . . . 17 14 revision history . . . . . . . . . . . . . . . . . . . . . . . 19 15 legal information . . . . . . . . . . . . . . . . . . . . . . 20 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 15.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 15.3 disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20 15.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 20 16 contact information . . . . . . . . . . . . . . . . . . . . 20 17 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 |
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